ANDESCON - Biannual Technical and Scientific Conference of the Andean Council of the IEEE

Centre de Recherche en Gestion et en Economie du Développement (CREGED) - Université Quisqueya
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Ecuador Oct 13 to 16 of 2020

ANDESCON is the biannual Technical and Scientific Conference of the Andean Council of the IEEE that brings together IEEE professionals and scientists from the Andean countries. The tenth edition of this IEEE event will be held in the wonderful city of Quito in Ecuador. The ANDESCON conference is an opportunity for professional members, academics, researchers and industrialists to will meet and present the developments and technological advances that move the Andean region countries.

IEEE ANDESCON 2020 will be held at Universidad Politécnica Salesiana (Quito Campus) virtually online with some punctual events in person if COVID-19 emergency allows that. 100% online option will be available in any case.

Submission Guidelines

Call for Papers

ANDESCON is the biannual Technical and Scientific Conference of the Andean Council of the IEEE that brings together IEEE professionals and scientists from the Andean countries. The tenth edition of this IEEE event will be held in the wonderful city of Quito in Ecuador. The ANDESCON conference is an opportunity for professional members, academics, researchers and industrialists to will meet and present the developments and technological advances that move the Andean region countries.

In consideration of the current situation that humanity is experiencing, especially the research community and in accordance with the request for non-mobilization to combat COVID-19, the Organizing Committee of IEEE ANDESCON 2020, in concert with the Steering Committee and IEEE Andean Council, has decided that the conference will run as a virtual conference (i.e., using remote audio/video support) and not as an in-person event.

The conference covers both theoretical and practical issues related to, but not limited to:

Circuits, Systems and Electron Devices

  • Communications
  • Industrial Electronics
  • Final Paper Submission: August 15th, 2020
  • Conference: October 13th to 16th, 2020

PAPER SUBMISSION

The articles must be submitted in digital format (PDF) through the paper submission page. Papers must be written in English. Papers must use the IEEE conference format. The maximum length is six (6) pages per article including illustrations and references. Each paper should indicate appropriateness for the scope of the Conference, originality and quality of the technical content, whole organization and writing style. Accepted papers will be published in the conference proceedings and submitted for inclusion in the IEEE Xplore Digital Library. All previous Andescon editions that meet the SCOPUS guidelines have been included in this index.

For each accepted paper, at least one of the authors must register and present the paper at the conference; no-show paper will not be submitted for inclusion in IEEE Xplore. All papers will be cross‐examined using anti‐plagiarism automated software tools.

SUBMISSION

TEMPLATE : 

  • IEEE Computational Intelligence Society
  • IEEE Robotics & Automation Society

Technical Chapter Tracks

  • Industrial ElectronicsAna Cabrera, Universidad TĂ©cnica del Norte, Ecuador
  • CommunicationsRomĂĄn Lara, Universidad de las Fuerzas Armadas ESPE, Ecuador
  • Computer and Software EngineeringAlexandra La Cruz, Universidad de IbaguĂ©, Colombia
  • Power and EnergyEsteban Inga, Universidad PolitĂ©cnica Salesiana, Ecuador
  • Engineering in Medicine and BiologyDavid Rivas, Universidad de las Fuerzas Armadas ESPE, EcuadorSandra PĂ©rez , Pontificia Universidad CatĂłlica PerĂș, PerĂș
  • Robotics and Automation Systems Ronald GutiĂ©rrez, Robotic People, Colombia 
  • Circuits, Systems and Electron DevicesLuis Miguel PrĂłcel, Universidad San Francisco de Quito, Ecuador
  • Computational IntelligenceRĂșben Medina, Universidad de los Andes, Venezuela
  • Smart MobilityJosĂ© Ignacio Huertas, TecnolĂłgico de Monterrey, MĂ©xico
  • EducationAngel Torres, Universidad PolitĂ©cnica Salesiana, Ecuador
  • Mechanics and MaterialsMary Vergara, Universidad PolitĂ©cnica Salesiana, EcuadorRafael Vasquez, Universidad Pontificia Bolivariana, Colombia

Technical Program Co-Chairs

  • Bosco Fernandes, University of Manchester, UK
  • Reza Katebi, University of Strathlyde, UK
  • Claudio Cañizares, University of Waterloo, Canada
  • Omar Escalona, University of Ulster, United Kingdom
  • JosĂ© Luis Rojo-Álvarez, Universidad Rey Juan Carlos, Spain
  • Rito Mijatez Castro, Instituto de Investigaciones ElĂ©ctricas, MĂ©xico
  • Francisco Novillo, Escuela Superior PolitĂ©cnica del Litoral, Ecuador
  • Diego Arcos, Universidad de las Fuerzas Armadas ESPE, Ecuador
  • Hugo Espinosa, Griffith University, Brisbane, Australia

Organizing committee

Carlos Lozano, Universidad de los Andes, Colombia.

General Co-Chair

Financial Chair

Publication Chair

Monica Huerta, Universidad Politécnica Salesiana, Ecuador.

Angel Torres-Toukoumidis, Universidad Politécnica Salesiana, Ecuador.

 

Andrea Jurado, Escuela Politécnica Nacional, Ecuador

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